Datasheet
0.1
1 10 100
I
SOURCE
(mA)
0.01
0.1
1
10
V
OUT
from V
+
(V)
V
S
= ±15V
125°C
85°C
25°C
-40°C
25V/DIV
5 Ps/DIV
V
S
= ±15V, A
V
= +1
INPUT
10 pF
2,200 pF
8,600 pF
12,200 pF
LM7321, LM7322
SNOSAW8D –MAY 2008–REVISED MARCH 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS
Figure 1. Output Swing vs. Sourcing Current Figure 2. Large Signal Step Response
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Human Body Model 2 kV
ESD Tolerance
(3)
Machine Model 200V
Charge-Device Model 1 kV
V
IN
Differential ±10V
Output Short Circuit Current See
(4)
Supply Voltage (V
S
= V
+
- V
−
) 35V
Voltage at Input/Output pins V
+
+0.8V, V
−
−0.8V
Storage Temperature Range −65°C to 150°C
Junction Temperature
(5)
150°C
Soldering Information: Infrared or Convection (20 sec.) 235°C
Wave Soldering (10 sec.) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Rating indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C. Short circuit test is a momentary test. Output short circuit duration is
infinite for V
S
≤ 6V at room temperature and below. For V
S
> 6V, allowable short circuit duration is 1.5 ms.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
) - T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
Supply Voltage (V
S
= V
+
- V
−
) 2.5V to 32V
Temperature Range
(1)
−40°C to 125°C
Package Thermal Resistance, θ
JA
,
(1)
5-Pin SOT-23 325°C/W
8-Pin VSSOP 235°C/W
8-Pin SOIC 165°C/W
(1) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
) - T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
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