Datasheet

LM7301
www.ti.com SNOS879H –AUGUST 1999–REVISED MARCH 2013
2.2V DC Electrical Characteristics
(1)
(continued)
Unless otherwise specified, all limits guaranteed for T
A
= 25°C, V
+
= 2.2V, V
−
= 0V, V
CM
= V
O
= V
+
/2 and R
L
> 1MΩ to V
+
/2.
Boldface limits apply at the temperature extremes.
LM7301
Symbol Parameter Conditions Units
Typ Limit
(2) (3)
I
SC
Output Short Circuit Current Sourcing 10.9 8.0 mA
5.5 min
Sinking 7.7 6.0 mA
5.0 min
I
S
Supply Current 0.57 0.97 mA
1.24 max
30V DC Electrical Characteristics
(1)
Unless otherwise specified, all limits guaranteed for T
A
= 25°C, V
+
= 30V, V
−
= 0V, V
CM
= V
O
= V
+
/2 and R
L
> 1MΩ to V
+
/2.
Boldface limits apply at the temperature extremes.
LM7301
Symbol Parameter Conditions Units
Typ Limit
(2) (3)
0.04 6 mV
V
OS
Input Offset Voltage
8 max
TCV
OS
Input Offset Voltage Average Drift 2 μV/°C
I
B
Input Bias Current V
CM
= 0V 103 300 nA
500 max
V
CM
= 30V −50 −100 nA
−200 min
I
OS
Input Offset Current V
CM
= 0V 1.2 90 nA
190 max
V
CM
= 30V 0.5 65 nA
135 max
R
IN
Input Resistance 0V ≤ V
CM
≤ 30V 200 MΩ
CMRR Common Mode Rejection Ratio 0V ≤ V
CM
≤ 30V 104 80 dB
78 min
0V ≤ V
CM
≤ 27V 115 90
88
PSRR Power Supply Rejection Ratio 2.2V ≤ V
+
≤ 30V 104 87
84
V
CM
Input Common-Mode Voltage Range CMRR > 80 dB 30.1 V
−0.1 V
A
V
Large Signal Voltage Gain R
L
= 10 kΩ 105 30 V/mV
V
O
= 28V
PP
20 min
V
O
Output Swing R
L
= 10 kΩ 0.16 0.275
V max
0.375
29.8 29.75
V min
28.65
I
SC
Output Short Circuit Current Sourcing
(4)
11.7 8.8 mA
6.5 min
Sinking
(4)
11.5 8.2 mA
6.0 min
(1) Electrical Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the devices such that T
J
= T
A
. No guarantee of parametric performance is indicated in the electrical tables under
conditions of internal self-heating where T
J
> T
A
.
(2) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
(3) All limits are guaranteed by testing or statistical analysis.
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board.
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