Datasheet

LM7301
SNOS879H –AUGUST 1999–REVISED MARCH 2013 www.ti.com
Gain and Phase,
Gain and Phase 2.7V Supply
Figure 3. Figure 4.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Value Unit
ESD Tolerance
(3)
Human Body Model 2500 V
Differential Input Voltage 15 V
Voltage at Input/Output Pin (V
+
) + 0.3V, (V
−
) −0.3 V
Supply Voltage (V
+
− V
−
) 35 V
Current at Input Pin ±10 mA
Current at Output Pin
(4)
±20 mA
Current at Power Supply Pin 25 mA
Soldering Information: http://www.ti.com/lit/an/snoa549c/snoa549c.pdf
Storage Temperature Range −65°C to +150 °C
Junction Temperature
(5)
150 °C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7.
(4) Applies to both single-supply and split-supply operation. Continuous short circuit operation at elevated ambient temperature can result in
exceeding the maximum allowed junction temperature of 150°C.
(5) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board.
Operating Ratings
(1)
Value Unit
Supply Voltage 1.8 ≤ V
S
≤ 32 V
Operating Temperature Range
(2)
−40 to +85 °C
Package Thermal Resistance (θ
JA
)
(2)
5-Pin SOT-23 325 °C/W
8-Pin SOIC 165 °C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
− T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board.
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