Datasheet

LM7301
SNOS879H –AUGUST 1999–REVISED MARCH 2013 www.ti.com
POWER DISSIPATION
Although the LM7301 has internal output current limiting, shorting the output to ground when operating on a
+30V power supply will cause the op amp to dissipate about 350 mW. This is a worst-case example. In the 8-pin
SOIC package, this will cause a temperature rise of 58°C. In the 5-pin SOT-23 package, the higher thermal
resistance will cause a calculated rise of 113°C. This can raise the junction temperature to above the absolute
maximum temperature of 150°C.
Operating from split supplies greatly reduces the power dissipated when the output is shorted. Operating on
±15V supplies can only cause a temperature rise of 29°C in the 8-pin SOIC and 57°C in the 5-pin SOT-23
package, assuming the short is to ground.
WIDE SUPPLY RANGE
The high power-supply rejection ratio (PSRR) and common-mode rejection ratio (CMRR) provide precision
performance when operated on battery or other unregulated supplies. This advantage is further enhanced by the
very wide supply range (2.2V–30V, guaranteed) offered by the LM7301. In situations where highly variable or
unregulated supplies are present, the excellent PSRR and wide supply range of the LM7301 benefit the system
designer with continued precision performance, even in such adverse supply conditions.
SPECIFIC ADVANTAGES OF 5-Pin SOT-23 (TinyPak)
The obvious advantage of the 5-pin SOT-23, TinyPak, is that it can save board space, a critical aspect of any
portable or miniaturized system design. The need to decrease overall system size is inherent in any handheld,
portable, or lightweight system application.
Furthermore, the low profile can help in height limited designs, such as consumer hand-held remote controls,
sub-notebook computers, and PCMCIA cards.
An additional advantage of the tiny package is that it allows better system performance due to ease of package
placement. Because the tiny package is so small, it can fit on the board right where the op amp needs to be
placed for optimal performance, unconstrained by the usual space limitations. This optimal placement of the tiny
package allows for many system enhancements, not easily achieved with the constraints of a larger package.
For example, problems such as system noise due to undesired pickup of digital signals can be easily reduced or
mitigated. This pick-up problem is often caused by long wires in the board layout going to or from an op amp. By
placing the tiny package closer to the signal source and allowing the LM7301 output to drive the long wire, the
signal becomes less sensitive to such pick-up. An overall reduction of system noise results.
Often times system designers try to save space by using dual or quad op amps in their board layouts. This
causes a complicated board layout due to the requirement of routing several signals to and from the same place
on the board. Using the tiny op amp eliminates this problem.
Additional space savings parts are available in tiny packages from Texas Instruments, including low power
amplifiers, precision voltage references, and voltage regulators.
LOW DISTORTION, HIGH OUTPUT
DRIVE CAPABILITY
The LM7301 offers superior low-distortion performance, with a total-harmonic-distortion-plus-noise of 0.06% at f
= 10 kHz. The advantage offered by the LM7301 is its low distortion levels, even at high output current and low
load resistance. Please refer to STABILITY CONSIDERATIONS for methods used to ensure stability under all
load conditions.
Typical Applications
HANDHELD REMOTE CONTROLS
The LM7301 offers outstanding specifications for applications requiring good speed/power trade-off. In
applications such as remote control operation, where high bandwidth and low power consumption are needed.
The LM7301 performance can easily meet these requirements.
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