Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
LM723CH ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM723CH
LM723CH/NOPB ACTIVE TO-100 LME 10 500 Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM 0 to 70 LM723CH
LM723CN ACTIVE PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 LM723CN
LM723CN/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS
& no Sb/Br)
CU SN Level-1-NA-UNLIM 0 to 70 LM723CN
LM723H ACTIVE TO-100 LME 10 500 TBD Call TI Call TI -55 to 150 LM723H
LM723H/NOPB ACTIVE TO-100 LME 10 500 Green (RoHS
& no Sb/Br)
POST-PLATE Level-1-NA-UNLIM -55 to 150 LM723H
U5R7723312 ACTIVE TO-100 LME 10 500 TBD Call TI Call TI -55 to 150 LM723H
U5R7723393 ACTIVE TO-100 LME 10 500 TBD Call TI Call TI 0 to 70 LM723CH
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.