Datasheet

LM63
2.2 nF
PROCESSOR
I
C
I
R
I
E
= I
F
2
3
D+
D-
LM63
www.ti.com SNAS190E –SEPTEMBER 2002–REVISED MAY 2013
USE OF THE LOOKUP TABLE FOR NON-LINEAR PWM VALUES VS TEMPERATURE
The Lookup Table, Registers 50 through 5F, can be used to create a non-linear PWM vs Temperature curve that
could be used to reduce the acoustic noise from processor fan due to linear or step transfer functions. An
example is given below.
EXAMPLE:
In a particular system it was found that the best acoustic fan noise performance was found to occur when the
PWM vs Temperature transfer function curve was parabolic in shape.
From 25°C to 105°C the fan is to go from 20% to 100%. Since there are 8 steps to the Lookup Table we will
break up the Temperature range into 8 separate temperatures. For the 80°C over 8-steps = 10°C per step. This
takes care of the x-axis.
For the PWM Value, we first select the PWM Frequency. In this example, we will make the PWM Frequency
(Register 4C) 20.
For 100% Duty Cycle then, the PWM value is 40. For 20%, the minimum is 40 x (0.2) = 8.
We can then arrange the PWM, Temperature pairs in a parabolic fashion in the form of y = 0.005 • (x −25)
2
+ 8
PWM VALUE CLOSEST PWM
TEMPERATURE
CALCULATED VALUE
25 8.0 8
35 8.5 9
45 10.0 10
55 12.5 13
65 16.0 16
75 20.5 21
85 26.0 26
95 32.5 33
105 40.0 40
We can then program the Lookup Table with the temperature and Closest PWM Values required for the curve
required in our example.
NON-IDEALITY FACTOR AND TEMPERATURE ACCURACY
The LM63 can be applied to remote diode sensing in the same way as other integrated-circuit temperature
sensors. It can be soldered to a printed-circuit board, and because the path of best thermal conductivity is
between the die and the pins, its temperature will effectively be that of the printed-circuit board lands and traces
soldered to its pins. This presumes that the ambient air temperature is nearly the same as the surface
temperature of the printed-circuit board. If the air temperature is much higher or lower than the surface
temperature, the actual temperature of the LM63 die will be an intermediate temperature between the surface
and air temperatures. Again, the primary thermal conduction path is through the leads, so the circuit board
surface temperature will contribute to the die temperature much more than the air temperature.
To measure the temperature external to the die use a remote diode. This diode can be located on the die of the
target IC, such as a CPU processor chip as shown in Figure 14, allowing measurement of the IC’s temperature,
independent of the LM63’s temperature. The LM63 has been optimized for use with the thermal diode on the die
of an Intel Pentium 4 or a Mobile Pentium 4 Processor-M processor.
Figure 14. Processor Connection to LM63
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