Datasheet

LM6211
SNOSAH2C –FEBRUARY 2006–REVISED MARCH 2013 www.ti.com
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
V
IN
Differential ±0.3V
Supply Voltage (V
S
= V
+
– V
−
) 25V
Voltage at Input/Output pins V
+
+0.3V, V
−
−0.3V
Storage Temperature Range −65°C to +150°C
Junction Temperature
(4)
+150°C
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp. (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human Body Model is 1.5 kΩ in series with 100 pF. Machine Model is 0Ω in series with 200 pF.
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Temperature Range −40°C to +125°C
Supply Voltage (V
S
= V
+
– V
−
) 5V to 24V
Package Thermal Resistance (θ
JA
(2)
) 5-Pin SOT-23 178°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/θ
JA
. All numbers apply for packages soldered directly onto a PC board.
5V Electrical Characteristics
(1)
Unless otherwise specified, all limits are ensured for T
A
= 25°C, V
+
= 5V, V
−
= 0V, V
CM
= V
O
= V
+
/2. Boldface limits apply at
the temperature extremes.
Symbol Parameter Conditions Min
(2)
Typ
(3)
Max
(2)
Units
V
OS
Input Offset Voltage V
CM
= 0.5V 0.1 ±2.5
mV
±2.8
TC V
OS
Input Offset Average Drift V
CM
= 0.5V
(4)
2 μV/C
I
B
Input Bias Current V
CM
= 0.5V
(5)(6)
0.5 5 pA
10 nA
I
OS
Input Offset Current V
CM
= 0.5V 0.1 pA
CMRR Common Mode Rejection Ratio 0 V ≤ V
CM
≤ 3V 83 98
dB
0.4 V ≤ V
CM
≤ 2.3 V 70
PSRR Power Supply Rejection Ratio V
+
= 5V to 24V, V
CM
= 0.5V 85 98
dB
78
V
+
= 4.5V to 25V, V
CM
= 0.5V 80 95
CMVR Input Common-Mode Voltage CMRR ≥ 65 dB 0 3.3
V
Range CMRR ≥ 60 dB 0 2.4
(1) Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using the
Statistical Quality Control (SQC) method.
(3) Typical values represent the most likely parametric norm at the time of characterization.
(4) Offset voltage average drift is determined by dividing the change in V
OS
at the temperature extremes into the total temperature change.
(5) Positive current corresponds to current flowing into the device.
(6) Input bias current is ensured by design.
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