Datasheet

LM6181
SNOS634B –MAY 1998–REVISED MAY 2013 www.ti.com
*Heat sinking pins
(1)
Figure 95. 16-Pin SOIC Package (M)
See Package Number D
(1) The typical junction-to-ambient thermal resistance of the molded PDIP(N) package soldered directly into a PC board is 102°C/W. The
junction-to-ambient thermal resistance of the SOIC (M) package mounted flush to the PC board is 70°C/W when pins 1, 4, 8, 9 and 16
are soldered to a total 2 in
2
1 oz. copper trace. The 16-pin SOIC (M) package must have pin 4 and at least one of pins 1, 8, 9, or 16
connected to V
−
for proper operation. The typical junction-to-ambient thermal resistance of the SOIC (M-8) package soldered directly
into a PC board is 153°C/W.
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