Datasheet

LM6181
www.ti.com SNOS634B –MAY 1998–REVISED MAY 2013
Absolute Maximum Ratings
(1)(2)
Supply Voltage ±18V
Differential Input Voltage ±6V
Input Voltage ±Supply Voltage
Inverting Input Current 15 mA
PDIP Package (N) Soldering (10 sec) 260°C
Soldering Information Vapor Phase (60 seconds) 215°C
SOIC Package (M)
Infrared (15 seconds) 220°C
Output Short Circuit See
(3)
Storage Temperature Range −65°C ≤ T
J
≤ +150°C
Maximum Junction Temperature 150°C
ESD Rating
(4)
±3000V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating ratings indicate conditions the
device is intended to be functional, but device parameter specifications may not be ensured under these conditions. For ensured
specifications and test conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature
of 150°C. Output currents in excess of ±130 mA over a long term basis may adversely affect reliability.
(4) Human body model 100 pF and 1.5 kΩ.
Operating Ratings
(1)
Supply Voltage Range 7V to 32V
LM6181AM −55°C ≤ T
J
≤ +125°C
Junction Temperature Range
(2)
LM6181AI, LM6181I −40°C ≤ T
J
≤ +85°C
8-pin PDIP (N) 102°C/W, 42°C/W
Thermal Resistance (θ
JA
, θ
JC
) 8-pin SOIC (M-8) 153°C/W, 42°C/W
16-pin SOIC (M) 70°C/W, 38°C/W
(1) For ensured Military Temperature Range parameters see RETS6181X.
(2) The typical junction-to-ambient thermal resistance of the molded PDIP(N) package soldered directly into a PC board is 102°C/W. The
junction-to-ambient thermal resistance of the SOIC (M) package mounted flush to the PC board is 70°C/W when pins 1, 4, 8, 9 and 16
are soldered to a total 2 in
2
1 oz. copper trace. The 16-pin SOIC (M) package must have pin 4 and at least one of pins 1, 8, 9, or 16
connected to V
−
for proper operation. The typical junction-to-ambient thermal resistance of the SOIC (M-8) package soldered directly
into a PC board is 153°C/W.
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