Datasheet

LM6171
www.ti.com SNOS745C –MAY 1998–REVISED MARCH 2013
Thermal resistance, θ
JA
, depends on parameters such as die size, package size and package material. The
smaller the die size and package, the higher θ
JA
becomes. The 8-pin PDIP package has a lower thermal
resistance (108°C/W) than that of 8-pin SOIC-8 (172°C/W). Therefore, for higher dissipation capability, use an 8-
pin PDIP package.
The total power dissipated in a device can be calculated as:
P
D
= P
Q
+ P
L
(3)
P
Q
is the quiescent power dissipated in a device with no load connected at the output. P
L
is the power dissipated
in the device with a load connected at the output; it is not the power dissipated by the load.
Furthermore,
P
Q
= supply current × total supply voltage with no load
P
L
= output current × (voltage difference between supply voltage and output voltage of the same supply)
For example, the total power dissipated by the LM6171 with V
S
= ±15V and output voltage of 10V into 1 kΩ load
resistor (one end tied to ground) is
P
D
= P
Q
+ P
L
= (2.5 mA) × (30V) + (10 mA) × (15V − 10V)
= 75 mW + 50 mW
= 125 mW
APPLICATION CIRCUITS
Figure 63. Fast Instrumentation Amplifier
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