Datasheet

LM555

SNAS548B –MAY 2004–REVISED JULY 2006

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Connection Diagram

Dual-In-Line, Small Outline

and Molded Mini Small Outline Packages

Figure 1. Top View

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1)

Supply Voltage +18V

Power Dissipation

(2)

LM555CM, LM555CN

(3)

1180 mW

LM555CMM 613 mW

Operating Temperature Ranges

LM555C 0°C to +70°C

Storage Temperature Range −65°C to +150°C

Soldering Information

Dual-In-Line Package

Soldering (10 Seconds) 260°C

Small Outline Packages

(SOIC and MSOP)

Vapor Phase (60 Seconds) 215°C

Infrared (15 Seconds) 220°C

See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. Electrical Characteristics state DC and AC electrical

specifications under particular test conditions which guarantee specific performance limits. This assumes that the device is within the

Operating Ratings. Specifications are not guaranteed for parameters where no limit is given, however, the typical value is a good

indication of device performance.

(2) For operating at elevated temperatures the device must be derated above 25°C based on a +150°C maximum junction temperature and

a thermal resistance of 106°C/W (DIP), 170°C/W (S0-8), and 204°C/W (MSOP) junction to ambient.

(3) Refer to RETS555X drawing of military LM555H and LM555J versions for specifications.

Product Folder Links: LM555