Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM555CMM VSSOP DGK 8 1000 203.0 190.0 41.0
LM555CMM/NOPB VSSOP DGK 8 1000 203.0 190.0 41.0
LM555CMMX/NOPB VSSOP DGK 8 3500 349.0 337.0 45.0
LM555CMX SOIC D 8 2500 349.0 337.0 45.0
LM555CMX/NOPB SOIC D 8 2500 349.0 337.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 17-Nov-2012
Pack Materials-Page 2