Datasheet

1
2
3
4
5
6
IN
OUT
IN_REF
INB
VCC
VEE
INB
VEE
IN
OUT
VCC
N/C
N/C
IN_REF
1
2
3
4
8
7
6
5
LM5112
SNVS234B –SEPTEMBER 2004–REVISED APRIL 2006 www.ti.com
Pin Configurations
Figure 2. WSON-6 Figure 3. MSOP-PowerPAD-8
PIN DESCRIPTIONS
Pin Name Description Application Information
WSON-6 MSOP-8
1 4 IN Non-inverting input pin TTL compatible thresholds. Pull up to VCC when not used.
2 3 VEE Power ground for driver outputs Connect to either power ground or a negative gate drive
supply for positive or negative voltage swing.
3 6 VCC Positive Supply voltage input Locally decouple to VEE. The decoupling capacitor should
be located close to the chip.
4 7 OUT Gate drive output Capable of sourcing 3A and sinking 7A. Voltage swing of
this output is from VEE to VCC.
5 1 IN_REF Ground reference for control inputs Connect to power ground (VEE) for standard positive only
output voltage swing. Connect to system logic ground when
VEE is connected to a negative gate drive supply.
6 2 INB Inverting input pin TTL compatible thresholds. Connect to IN_REF when not
used.
- - - 5, 8 N/C Not internally connected
- - - - - - Exposed Exposed Pad, underside of package Internally bonded to the die substrate. Connect to VEE
Pad ground pin for low thermal impedance.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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