Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
Power
PAD
LM5111-4MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LM5111-4MY/NOPB MSOP-
Power
PAD
DGN 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM5111-4MYX/NOPB MSOP-
Power
PAD
DGN 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM5111-1MX SOIC D 8 2500 367.0 367.0 35.0
LM5111-1MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM5111-1MY/NOPB MSOP-PowerPAD DGN 8 1000 210.0 185.0 35.0
LM5111-1MYX/NOPB MSOP-PowerPAD DGN 8 3500 367.0 367.0 35.0
LM5111-2MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM5111-2MY/NOPB MSOP-PowerPAD DGN 8 1000 210.0 185.0 35.0
LM5111-2MYX/NOPB MSOP-PowerPAD DGN 8 3500 367.0 367.0 35.0
LM5111-3MX SOIC D 8 2500 367.0 367.0 35.0
LM5111-3MX/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2