Datasheet
LM5107
SNVS333D –NOVEMBER 2004–REVISED MARCH 2013
www.ti.com
Electrical Characteristics
Specifications in standard typeface are for T
J
= +25°C, and those in boldface type apply over the full operating junction
temperature range. Unless otherwise specified, V
DD
= V
HB
= 12V, V
SS
= V
HS
= 0V, No Load on LO or HO.
Symbol Parameter Conditions Min
(1)
Typ Max
(1)
Units
SUPPLY CURRENTS
I
DD
V
DD
Quiescent Current LI = HI = 0V 0.3 0.6 mA
I
DDO
V
DD
Operating Current f = 500 kHz 2.1 3.4 mA
I
HB
Total HB Quiescent Current LI = HI = 0V 0.06 0.2 mA
I
HBO
Total HB Operating Current f = 500 kHz 1.6 3.0 mA
I
HBS
HB to V
SS
Current, Quiescent V
HS
= V
HB
= 100V 0.1 10 µA
I
HBSO
HB to V
SS
Current, Operating f = 500 kHz 0.5 mA
INPUT PINS LI and HI
V
IL
Low Level Input Voltage Threshold 0.8 1.8 V
V
IH
High Level Input Voltage Threshold 1.8 2.2 V
R
I
Input Pulldown Resistance 100 180 500 kΩ
UNDER VOLTAGE PROTECTION
V
DDR
V
DD
Rising Threshold V
DDR
= V
DD
- V
SS
6.0 6.9 7.4 V
V
DDH
V
DD
Threshold Hysteresis 0.5 V
V
HBR
HB Rising Threshold V
HBR
= V
HB
- V
HS
5.7 6.6 7.1 V
V
HBH
HB Threshold Hysteresis 0.4 V
BOOT STRAP DIODE
V
DL
I
VDD-HB
= 100 µA
Low-Current Forward Voltage 0.58 0.9 V
V
DL
= V
DD
- V
HB
V
DH
I
VDD-HB
= 100 mA
High-Current Forward Voltage 0.82 1.1 V
V
DH
= V
DD
- V
HB
R
D
Dynamic Resistance I
VDD-HB
= 100 mA 0.8 1.5 Ω
LO GATE DRIVER
V
OLL
I
LO
= 100 mA
Low-Level Output Voltage 0.28 0.45 V
V
OHL
= V
LO
– V
SS
V
OHL
I
LO
= −100 mA,
High-Level Output Voltage 0.45 0.75 V
V
OHL
= V
DD
– V
LO
I
OHL
Peak Pullup Current V
LO
= 0V 1.3 A
I
OLL
Peak Pulldown Current V
LO
= 12V 1.4 A
HO GATE DRIVER
V
OLH
I
HO
= 100 mA
Low-Level Output Voltage 0.28 0.45 V
V
OLH
= V
HO
– V
HS
V
OHH
I
HO
= −100 mA
High-Level Output Voltage 0.45 0.75 V
V
OHH
= V
HB
– V
HO
I
OHH
Peak Pullup Current V
HO
= 0V 1.3 A
I
OLH
Peak Pulldown Current V
HO
= 12V 1.4 A
THERMAL RESISTANCE
θ
JA
(2)
SOIC 160
Junction to Ambient °C/W
WSON
(3)
40
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) The θ
JA
is not a constant for the package and depends on the printed circuit board design and the operating conditions.
(3) 4 layer board with Cu finished thickness 1.5/1/1/1.5 oz. Maximum die size used. 5x body length of Cu trace on PCB top. 50 x 50mm
ground and power planes embedded in PCB. See Application Note AN-1187.
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