Datasheet
LM5105
SNVS349C –FEBRUARY 2005–REVISED MARCH 2013
www.ti.com
Electrical Characteristics
Specifications in standard typeface are for T
J
= +25°C, and those in boldface type apply over the full operating junction
temperature range. Unless otherwise specified, V
DD
= HB = 12V, V
SS
= HS = 0V, EN = 5V. No load on LO or HO. RDT=
100kΩ
(1)
.
Symbol Parameter Conditions Min Typ Max Units
SUPPLY CURRENTS
I
DD
V
DD
Quiescent Current IN = EN = 0V 0.34 0.6 mA
I
DDO
V
DD
Operating Current f = 500 kHz 1.65 3 mA
I
HB
Total HB Quiescent Current IN = EN = 0V 0.06 0.2 mA
I
HBO
Total HB Operating Current f = 500 kHz 1.3 3 mA
I
HBS
HB to V
SS
Current, Quiescent HS = HB = 100V 0.05 10 µA
I
HBSO
HB to V
SS
Current, Operating f = 500 kHz 0.1 mA
INPUT IN and EN
V
IL
Low Level Input Voltage Threshold 0.8 1.8 V
V
IH
High Level Input Voltage Threshold 1.8 2.2 V
R
pd
Input Pulldown Resistance Pin IN and EN 100 200 500 kΩ
DEAD-TIME CONTROLS
VRDT Nominal Voltage at RDT 2.7 3 3.3 V
IRDT RDT Pin Current Limit RDT = 0V 0.75 1.5 2.25 mA
UNDER VOLTAGE PROTECTION
V
DDR
V
DD
Rising Threshold 6.0 6.9 7.4 V
V
DDH
V
DD
Threshold Hysteresis 0.5 V
V
HBR
HB Rising Threshold 5.7 6.6 7.1 V
V
HBH
HB Threshold Hysteresis 0.4 V
BOOT STRAP DIODE
V
DL
Low-Current Forward Voltage I
VDD-HB
= 100 µA 0.6 0.9 V
V
DH
High-Current Forward Voltage I
VDD-HB
= 100 mA 0.85 1.1 V
R
D
Dynamic Resistance I
VDD-HB
= 100 mA 0.8 1.5 Ω
LO GATE DRIVER
V
OLL
Low-Level Output Voltage I
LO
= 100 mA 0.25 0.4 V
V
OHL
I
LO
= –100 mA,
High-Level Output Voltage 0.35 0.55 V
V
OHL
= V
DD
– V
LO
I
OHL
Peak Pullup Current LO = 0V 1.8 A
I
OLL
Peak Pulldown Current LO = 12V 1.6 A
HO GATE DRIVER
V
OLH
Low-Level Output Voltage I
HO
= 100 mA 0.25 0.4 V
V
OHH
I
HO
= –100 mA,
High-Level Output Voltage 0.35 0.55 V
V
OHH
= HB – HO
I
OHH
Peak Pullup Current HO = 0V 1.8 A
I
OLH
Peak Pulldown Current HO = 12V 1.6 A
THERMAL RESISTANCE
θ
JA
Junction to Ambient See
(2)(3)
40 °C/W
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) 4 layer board with Cu finished thickness 1.5/1.0/1.0/1.5 oz. Maximum die size used. 5x body length of Cu trace on PCB top. 50 x 50mm
ground and power planes embedded in PCB. See Application Note AN-1187.
(3) The θ
JA
is not a constant for the package and depends on the printed circuit board design and the operating conditions.
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