Datasheet
LM5104
SNVS269C –JANUARY 2004–REVISED MARCH 2013
www.ti.com
Electrical Characteristics
Specifications in standard typeface are for T
J
= +25°C, and those in boldface type apply over the full operating junction
temperature range. Unless otherwise specified, V
DD
= V
HB
= 12V, V
SS
= V
HS
= 0V, RT = 100kΩ. No Load on LO or HO.
Symbol Parameter Conditions Min
(1)
Typ Max
(1)
Units
SUPPLY CURRENTS
I
DD
V
DD
Quiescent Current LI = HI = 0V 0.4 0.6 mA
I
DDO
V
DD
Operating Current f = 500 kHz 1.9 3 mA
I
HB
Total HB Quiescent Current LI = HI = 0V 0.06 0.2 mA
I
HBO
Total HB Operating Current f = 500 kHz 1.3 3 mA
I
HBS
HB to V
SS
Current, Quiescent V
HS
= V
HB
= 100V 0.05 10 µA
I
HBSO
HB to V
SS
Current, Operating f = 500 kHz 0.08 mA
INPUT PINS
V
IL
Low Level Input Voltage Threshold 0.8 1.8 V
V
IH
High Level Input Voltage Threshold 1.8 2.2 V
R
I
Input Pulldown Resistance 100 200 500 kΩ
TIME DELAY CONTROLS
V
RT
Nominal Voltage at RT 2.7 3 3.3 V
I
RT
RT Pin Current Limit RT = 0V 0.75 1.5 2.25 mA
T
D1
Delay Timer, RT = 10 kΩ 58 90 130 ns
T
D2
Delay Timer, RT = 100 kΩ 140 200 270 ns
UNDER VOLTAGE PROTECTION
V
DDR
V
DD
Rising Threshold 6.0 6.9 7.4 V
V
DDH
V
DD
Threshold Hysteresis 0.5 V
V
HBR
HB Rising Threshold 5.7 6.6 7.1 V
V
HBH
HB Threshold Hysteresis 0.4 V
BOOT STRAP DIODE
V
DL
Low-Current Forward Voltage I
VDD-HB
= 100 µA 0.60 0.9 V
V
DH
High-Current Forward Voltage I
VDD-HB
= 100 mA 0.85 1.1 V
R
D
Dynamic Resistance I
VDD-HB
= 100 mA 0.8 1.5 Ω
LO GATE DRIVER
V
OLL
Low-Level Output Voltage I
LO
= 100 mA 0.25 0.4 V
V
OHL
I
LO
= –100 mA
High-Level Output Voltage 0.35 0.55 V
V
OHL
= V
DD
– V
LO
I
OHL
Peak Pullup Current V
LO
= 0V 1.6 A
I
OLL
Peak Pulldown Current V
LO
= 12V 1.8 A
HO GATE DRIVER
V
OLH
Low-Level Output Voltage I
HO
= 100 mA 0.25 0.4 V
V
OHH
I
HO
= –100 mA,
High-Level Output Voltage 0.35 0.55 V
V
OHH
= V
HB
– V
HO
I
OHH
Peak Pullup Current V
HO
= 0V 1.6 A
I
OLH
Peak Pulldown Current V
HO
= 12V 1.8 A
THERMAL RESISTANCE
θ
JA
(2)
SOIC 170
Junction to Ambient °C/W
WSON
(3)
40
(1) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlation
using Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) The θ
JA
is not a given constant for the package and depends on the printed circuit board design and the operating environment.
(3) 4 layer board with Cu finished thickness 1.5/1/1/1.5 oz. Maximum die size used. 5x body length of Cu trace on PCB top. 50 x 50mm
ground and power planes embedded in PCB. See Application Note AN-1187.
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