Datasheet

LM5018
www.ti.com SNVS787E –JANUARY 2012–REVISED DECEMBER 2013
Absolute Maximum Ratings
(1)(2)
V
IN
, UVLO to RTN –0.3 V to 100 V
SW to RTN –1.5 V to V
IN
+0.3 V
SW to RTN (100ns transient) –5 V to VIN +0.3 V
BST to V
CC
100 V
BST to SW 13 V
R
ON
to RTN –0.3 V to 100 V
V
CC
to RTN –0.3 V to 13 V
FB to RTN –0.3 V to 5 V
ESD Rating (Human Body Model
(3)
2 kV
Lead Temperature
(4)
200°C
Storage Temperature Range –55°C to +150°C
Maximum Junction Temperature 150°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For verified specifications and test conditions, see the Electrical Characteristics. The
RTN pin is the GND reference electrically connected to the substrate.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
(4) Max solder time not to exceed 4 seconds.
Recommended Operating Conditions
(1)
V
IN
Voltage 7.5 V to 100 V
Operating Junction Temperature −40°C to +125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For verified specifications and test conditions, see the Electrical Characteristics. The
RTN pin is the GND reference electrically connected to the substrate.
Thermal Characteristics
WSON-8 SO PowerPAD-8 UNIT
θ
JA
Junction-to-ambient thermal resistance 41.3 41.1 °C/W
θ
JCbot
Junction-to-case (bottom) thermal resistance 3.2 2.4 °C/W
Ψ
JB
Junction-to-board thermal characteristic parameter 19.2 24.4 °C/W
θ
JB
Junction-to-board thermal resistance 19.1 30.6 °C/W
θ
JCtop
Junction-to-case (top) thermal resistance 34.7 37.3 °C/W
Ψ
JT
Junction-to-top thermal characteristic parameter 0.3 6.7 °C/W
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