Datasheet

LM5017
www.ti.com SNVS783G –JANUARY 2012–REVISED DECEMBER 2013
Absolute Maximum Ratings
(1)(2)
V
IN
, UVLO to RTN –0.3 V to 100 V
SW to RTN –1.5 V to V
IN
+0.3 V
SW to RTN (100 ns transient) –5 V to V
IN
+0.3 V
BST to V
CC
100 V
BST to SW 13 V
R
ON
to RTN –0.3 V to 100 V
V
CC
to RTN –0.3 V to 13 V
FB to RTN –0.3 V to 5 V
ESD Rating (Human Body Model
(3)
2 kV
Lead Temperature
(4)
200°C
Storage Temperature Range –55°C to +150°C
Maximum Junction Temperature 150°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
The RTN pin is the GND reference electrically connected to the substrate.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin.
(4) For detailed information on soldering plastic SO PowerPAD package, refer to the SNOA549 available from Texas Instruments. Max
solder time not to exceed 4 seconds.
Recommended Operating Conditions
(1)
V
IN
Voltage 7.5 V to 100 V
Operating Junction Temperature −40°C to +125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is intended to be functional. For ensured specifications and test conditions, see the Electrical Characteristics.
The RTN pin is the GND reference electrically connected to the substrate.
Thermal Characteristics
(1)
WSON-8 SO PowerPAD-8 UNIT
θ
JA
Junction-to-ambient thermal resistance 41.3 41.1 °C/W
θ
JCbot
Junction-to-case (bottom) thermal resistance 3.2 2.4 °C/W
Ψ
JB
Junction-to-board thermal characteristic parameter 19.2 24.4 °C/W
θ
JB
Junction-to-board thermal resistance 19.1 30.6 °C/W
θ
JCtop
Junction-to-case (top) thermal resistance 34.7 37.3 °C/W
Ψ
JT
Junction-to-top thermal characteristic parameter 0.3 6.7 °C/W
(1) The package thermal impedance is calculated in accordance with JESD 51.
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