Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
14-Feb-2014
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM5010AMH/NOPB ACTIVE HTSSOP PWP 14 94 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 150 L5010
AMH
LM5010AMHE/NOPB ACTIVE HTSSOP PWP 14 250 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 150 L5010
AMH
LM5010AMHX NRND HTSSOP PWP 14 2500 TBD Call TI Call TI -40 to 150 L5010
AMH
LM5010AMHX/NOPB ACTIVE HTSSOP PWP 14 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 150 L5010
AMH
LM5010AQ0MH/NOPB ACTIVE HTSSOP PWP 14 94 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 150 L5010A
Q0MH
LM5010AQ0MHX/NOPB ACTIVE HTSSOP PWP 14 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 150 L5010A
Q0MH
LM5010AQ1MH/NOPB ACTIVE HTSSOP PWP 14 94 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 L5010A
Q1MH
LM5010AQ1MHX/NOPB ACTIVE HTSSOP PWP 14 2500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 125 L5010A
Q1MH
LM5010ASD NRND WSON DPR 10 1000 TBD Call TI Call TI -40 to 150 L00065B
LM5010ASD/NOPB ACTIVE WSON DPR 10 1000 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 150 L00065B
LM5010ASDX/NOPB ACTIVE WSON DPR 10 4500 Green (RoHS
& no Sb/Br)
CU SN Level-1-260C-UNLIM -40 to 150 L00065B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.