Datasheet

LM4938
SNAS245B –FEBRUARY 2005–REVISED MAY 2013 www.ti.com
Typical Performance Characteristics (continued)
Power Derating Curve
(1)
Dropout Voltage
Figure 38. Figure 39.
External Gain/
Power Dissipation vs Output Power Bass Boost Characteristics
Figure 40. Figure 41.
Power Dissipation vs
Power Dissipation vs Output Power Output Power
Figure 42. Figure 43.
(1) These curves show the thermal dissipation ability of the LM4938MH at different ambient temperatures given these conditions:
500LFPM + 2in
2
: The part is soldered to a 2in
2
, 1 oz. copper plane with 500 linear feet per minute of forced-air flow across it.
2in
2
on bottom: The part is soldered to a 2in
2
, 1oz. copper plane that is on the bottom side of the PC board through 21 8 mil vias.
2in
2
: The part is soldered to a 2in
2
, 1oz. copper plane.
1in
2
: The part is soldered to a 1in
2
, 1oz. copper plane.
Not Attached: The part is not soldered down and is not forced-air cooled.
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