Datasheet

LM4936
www.ti.com SNAS269A –APRIL 2005–REVISED APRIL 2013
Typical Performance Characteristics (continued)
Output Power/Channel vs Supply Voltage
R
L
= 32Ω, A
V-SE
= 1V/V, 80kHz BW Power Derating Curve
These curves show the thermal dissipation ability of the LM4936MH at
different ambient temperatures given these conditions:
500LFPM + 2in
2
: The part is soldered to a 2in
2
, 1 oz. copper plane
with 500 linear feet per minute of forced-air flow across it.
2in
2
on bottom: The part is soldered to a 2in
2
, 1oz. copper plane that
is on the bottom side of the PC board through 21 8 mil vias.
2in
2
: The part is soldered to a 2in
2
, 1oz. copper plane.
1in
2
: The part is soldered to a 1in
2
, 1oz. copper plane.
Not Attached: The part is not soldered down and is not forced-air
cooled.
Figure 40. Figure 41.
Power Dissipation vs Output Power/Channel Power Dissipation vs Output Power/Channel
V
DD
= 5V, A
V-BTL
= 2V/V, THD+N ≤ 1%, 80kHz BW V
DD
= 3V, A
V-BTL
= 2V/V, THD+N ≤ 1%, 80kHz BW
Figure 42. Figure 43.
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