Datasheet
Exposed DAP
LM4917
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SNAS238G –AUGUST 2004–REVISED MAY 2013
LM4917 Reference Design Boards
Bill Of Materials
Part Description Qty Ref Designator
LM4917 Mono Reference Design Board 1
LM4917 Audio AMP 1 U1
Tantalum Cap 1µF 16V 10 1 Cs
Ceramic Cap 0.39µF 50V Z50 20 2 Ci
Resistor 20kΩ 1/10W 5 4 Ri, Rf
Resistor 100kΩ 1/10W 5 1 Rpu
Jumper Header Vertical Mount 2X1, 0.100 1 J1
PCB Layout Guidelines
This section provides practical guidelines for mixed signal PCB layout that involves various digital/analog power
and ground traces. Designers should note that these are only "rule-of-thumb" recommendations and the actual
results will depend heavily on the final layout.
Avoiding Shorts on the Charge Pump Outputs
For the LM4917SD package, the exposed dap is connected to the substrate of the device. Because LM4917’s
charge pump is powered by both a negative and positive supply the exposed dap must be left floating. This will
avoid shorting the charge pump outputs.
Figure 30. Bottom View of LM4917SD Package
Minimization of THD
PCB trace impedance on the power, ground, and all output traces should be minimized to achieve optimal THD
performance. Therefore, use PCB traces that are as wide as possible for these connections. As the gain of the
amplifier is increased, the trace impedance will have an ever increasing adverse affect on THD performance. At
unity-gain (0dB) the parasitic trace impedance effect on THD performance is reduced but still a negative factor in
the THD performance of the LM4917 in a given application.
General Mixed Signal Layout Recommendation
Power and Ground Circuits
For two layer mixed signal design, it is important to isolate the digital power and ground trace paths from the
analog power and ground trace paths. Star trace routing techniques (bringing individual traces back to a central
point rather than daisy chaining traces together in a serial manner) can greatly enhance low level signal
performance. Star trace routing refers to using individual traces to feed power and ground to each circuit or even
device. This technique will require a greater amount of design time, but will not increase the final price of the
board. The only extra parts required may be some jumpers.
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