Datasheet

0
100
200
300
OUTPUT POWER (mW)
0
200
400
600
POWER DISSIPATION (mW)
250
150
50
500
300
100
20 50 100 200 500 1k 2k 5k 10k 20k
0.01
0.02
0.05
0.1
0.2
0.5
1
2
5
10
THD + N (%)
FREQUENCY (Hz)
1m
5m 20m 200m
OUTPUT POWER (W)
0.001
0.02
0.5
10
THD + N (%)
50m10m
2m
5
1
0.1
0.05
0.002
2
0.01
0.005
0.2
100m
20kHz
1kHz
20Hz
LM4911, LM4911Q
SNAS152M –MAY 2004–REVISED JUNE 2011 www.ti.com
Typical Performance Characteristics
LM4911/LM4911Q Specific Characteristics
The NGY0010A package has its exposed-DAP soldered to an exposed 1.2in
2
area of 1oz. Printed circuit board copper.
THD+N
vs THD+N
Frequency vs
at V
DD
= 5V, R
L
= 16Ω Output Power
P
O
= 100mW, OCL at V
DD
= 5V, R
L
= 16Ω, OCL
Figure 59. Figure 60.
Power Dissipation
vs
Output Power
at V
DD
= 5V, R
L
= 16Ω
THD+N ≤ 1%, OCL
Figure 61.
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