Datasheet
LM4898, LM4898MMBD
SNAS216E –MAY 2003–REVISED APRIL 2013
www.ti.com
Typical Application
Figure 4. Typical Audio Amplifier Application Circuit
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to V
DD
+0.3V
Power Dissipation
(3)
Internally Limited
ESD Susceptibility
(4)
2000V
ESD Susceptibility
(5)
200V
Junction Temperature 150°C
Thermal Resistance θ
JC
(WSON) 12°C/W
θ
JA
(WSON) 63°C/W
θ
JA
(DSBGA) 220°C/W
θ
JC
(VSSOP) 56°C/W
θ
JA
(VSSOP) 190°C/W
For Soldering Information, see AN-1112 DSBGA Wafer Level Chip Scale Package (SNVA009).
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics VDD = 3V state DC and AC
electrical specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within
the Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good
indication of device performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
, θ
JA
, and the ambient temperature
T
A
. The maximum allowable power dissipation is P
DMAX
= (T
JMAX
–T
A
)/θ
JA
or the number given in Absolute Maximum Ratings, whichever
is lower.
(4) Human body model, 100pF discharged through a 1.5kΩ resistor.
(5) Machine Model, 220pF–240pF discharged through all pins.
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