Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- KEY SPECIFICATIONS
- DESCRIPTION
- Absolute Maximum Ratings
- Operating Ratings
- Electrical Characteristics VDD = 5V
- Electrical Characteristics VDD = 3V
- Electrical Characteristics VDD = 2.6V
- External Components Description
- Typical Performance Characteristics
- Application Information
- BRIDGED CONFIGURATION EXPLANATION
- EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATIONS FOR THE LM4890LD
- POWER DISSIPATION
- POWER SUPPLY BYPASSING
- SHUTDOWN FUNCTION
- SHUTDOWN OUTPUT IMPEDANCE
- PROPER SELECTION OF EXTERNAL COMPONENTS
- AUDIO POWER AMPLIFIER DESIGN
- LM4890 SOIC DEMO BOARD ARTWORK
- LM4890 VSSOP DEMO BOARD ARTWORK
- PCB LAYOUT GUIDELINES
- GENERAL MIXED SIGNAL LAYOUT RECOMMENDATIONS
- Revision History
- Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM4890LDX/NOPB WSON NGZ 10 4500 330.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1
LM4890MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM4890MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM4890MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 12-Aug-2013
Pack Materials-Page 1