Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- KEY SPECIFICATIONS
- DESCRIPTION
- Absolute Maximum Ratings
- Operating Ratings
- Electrical Characteristics VDD = 5V
- Electrical Characteristics VDD = 3V
- Electrical Characteristics VDD = 2.6V
- External Components Description
- Typical Performance Characteristics
- Application Information
- BRIDGED CONFIGURATION EXPLANATION
- EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATIONS FOR THE LM4890LD
- POWER DISSIPATION
- POWER SUPPLY BYPASSING
- SHUTDOWN FUNCTION
- SHUTDOWN OUTPUT IMPEDANCE
- PROPER SELECTION OF EXTERNAL COMPONENTS
- AUDIO POWER AMPLIFIER DESIGN
- LM4890 SOIC DEMO BOARD ARTWORK
- LM4890 VSSOP DEMO BOARD ARTWORK
- PCB LAYOUT GUIDELINES
- GENERAL MIXED SIGNAL LAYOUT RECOMMENDATIONS
- Revision History
- Page 1

LM4890
www.ti.com
SNAS138L –SEPTEMBER 2001–REVISED MAY 2013
Typical Performance Characteristics (continued)
Supply Current Clipping (Dropout) Voltage
vs Ambient Temperature vs Supply Voltage
Figure 50. Figure 51.
Max Die Temp Max Die Temp
at P
DMAX
(9 bump DSBGA) at P
DMAX
(8 bump DSBGA)
Figure 52. Figure 53.
Supply Current
Output Offset Voltage vs Shutdown Voltage
Figure 54. Figure 55.
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