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LM4890

www.ti.com

SNAS138L –SEPTEMBER 2001–REVISED MAY 2013

LM4890 1 Watt Audio Power Amplifier

Check for Samples: LM4890

FEATURES

DESCRIPTION

The LM4890 is an audio power amplifier primarily

• Available in Space-Saving Packages: DSBGA,

designed for demanding applications in mobile

VSSOP, SOIC, and WSON

phones and other portable communication device

• Ultra Low Current Shutdown Mode

applications. It is capable of delivering 1 watt of

• BTL Output Can Drive Capacitive Loads

continuous average power to an 8Ω BTL load with

less than 1% distortion (THD+N) from a 5V

power

• Improved Pop & Click Circuitry Eliminates

supply.

Noises During Turn-On and Turn-Off

Transitions

Boomer audio power amplifiers were designed

specifically to provide high quality output power with a

• 2.2 - 5.5V Operation

minimal amount of external components. The

• No Output Coupling Capacitors, Snubber

LM4890 does not require output coupling capacitors

Networks or Bootstrap Capacitors Required

or bootstrap capacitors, and therefore is ideally suited

• Thermal Shutdown Protection

for mobile phone and other low voltage applications

where minimal power consumption is a primary

• Unity-Gain Stable

requirement.

• External Gain Configuration Capability

The LM4890 features a low-power consumption

shutdown mode, which is achieved by driving the

APPLICATIONS

shutdown pin with logic low. Additionally, the LM4890

• Mobile Phones

features an internal thermal shutdown protection

• PDAs

mechanism.

• Portable Electronic Devices

The LM4890 contains advanced pop & click circuitry

which eliminates noises which would otherwise occur

KEY SPECIFICATIONS

during turn-on and turn-off transitions.

• PSRR at 217Hz, VDD = 5V (Fig. 1): 62dB(typ.)

The LM4890 is unity-gain stable and can be

configured by external gain-setting resistors.

• Power Output at 5.0V & 1% THD: 1W(typ.)

• Power Output at 3.3V & 1% THD: 400mW(typ.)

• Shutdown Current: 0.1μA(typ.)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (36 pages)

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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 LM4890 1 Watt Audio Power Amplifier Check for Samples: LM4890 FEATURES DESCRIPTION • The LM4890 is an audio power amplifier primarily designed for demanding applications in mobile phones and other portable communication device applications. It is capable of delivering 1 watt of continuous average power to an 8Ω BTL load with less than 1% distortion (THD+N) from a 5VDC power supply.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Connection Diagrams Top View Top View Figure 1. 8 Bump DSBGA Package See Package Number YPB0008 Figure 2. 9 Bump DSBGA Package See Package Number YZR0009 Top View Top View Figure 3. WSON Package See Package Number NGZ0010B Figure 4. Mini Small Outline (VSSOP) Package See Package Number DGK0008A Top View Top View Figure 5. Small Outline (SOIC) Package See Package Number D0008A 2 Figure 6.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Typical Application Rf CS 1PF Audio Input VDD 20k RIN 20k 15pF VOUT1 - A1 CIN 0.39PF 10k 20k RL 8: SW 20k 250k 500k CBYPASS 1PF 250k Bias A2 Shutdown Control 10k VOUT2 + VIH VIL GND Figure 7. Typical Audio Amplifier Application Circuit These devices have limited built-in ESD protection.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Absolute Maximum Ratings (1) (2) Supply Voltage (3) 6.0V −65°C to +150°C Storage Temperature −0.3V to VDD +0.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Electrical Characteristics VDD = 5V (1) (2) (3) The following specifications apply for the circuit shown in Figure 7 unless otherwise specified. Limits apply for TA = 25°C. Parameter IDD Test Conditions Quiescent Power Supply Current LM4890 Typical (4) Limit (5) (6) Units (Limits) VIN = 0V, Io = 0A, No Load 4 8 mA (max) VIN = 0V, Io = 0A, 8Ω Load 5 10 mA (max) 0.1 2.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Electrical Characteristics VDD = 3V(1)(2)(3) (continued) The following specifications apply for the circuit shown in Figure 7 unless otherwise specified. Limits apply for TA = 25°C. Parameter VOS Output Offset Voltage ROUT-GND Resistor Output to Gnd (7) Test Conditions Limit (5) Wake-up time Output Power (8Ω) TSD Thermal Shutdown Temperature THD+N Total Harmonic Distortion + Noise Po = 0.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 External Components Description (See Figure 7) Components Functional Description 1. RIN Inverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high pass filter with CIN at fC= 1/(2π RINCIN). 2. CIN Input coupling capacitor which blocks the DC voltage at the amplifier's input terminals. Also creates a highpass filter with RIN at fc = 1/(2π RINCIN).
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics 8 THD+N vs Frequency at VDD = 5V, 8Ω RL, and PWR = 250mW, AV = 2 THD+N vs Frequency at VDD = 3.3V, 8Ω RL, and PWR = 150mW, AV = 2 Figure 8. Figure 9. THD+N vs Frequency at VDD = 3V, RL = 8Ω, PWR = 250mW, AV = 2 THD+N vs Frequency at VDD = 2.6V, RL = 8Ω, PWR = 100mW, AV = 2 Figure 10. Figure 11. THD+N vs Frequency at VDD = 2.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Typical Performance Characteristics (continued) THD+N vs Power Out at VDD = 3.3V, RL = 8Ω, 1kHz, AV = 2 THD+N vs Power Out at VDD = 3V, RL = 8Ω, 1kHz, AV = 2 Figure 14. Figure 15. THD+N vs Power Out at VDD = 2.6V, RL = 8Ω, 1kHz, AV = 2 THD+N vs Power Out at VDD = 2.6V, RL = 4Ω, 1kHz, AV = 2 Figure 16. Figure 17.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) 10 Power Supply Rejection Ratio (PSRR) at AV = 4 VDD = 5V, Vripple = 200mvp-p RL = 8Ω, RIN = 10Ω Power Supply Rejection Ratio (PSRR) at AV = 4 VDD = 5V, Vripple = 200mvp-p RL = 8Ω, RIN = Float Figure 20. Figure 21.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Typical Performance Characteristics (continued) Power Supply Rejection Ratio (PSRR) at AV = 2 VDD = 3.3V, Vripple = 200mvp-p, RL = 8Ω, RIN = 10Ω Power Supply Rejection Ratio (PSRR) at AV = 2 VDD = 2.6V, Vripple = 200mvp-p, RL = 8Ω, RIN = 10Ω Figure 26. Figure 27.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) PSRR vs DC Output Voltage VDD = 3V, AV = 4 10 0 0 -10 -10 PSRR (dBr) PSRR (dBr) PSRR vs DC Output Voltage VDD = 3V, AV = 10 1 0 -20 -30 -40 -20 -30 -40 -50 -50 -60 -3 -2 -1 0 1 2 3 -60 -3 -2 -1 0 V OUTDC (V) 12 2 Figure 32. Figure 33.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Typical Performance Characteristics (continued) LM4890 vs LM4877 Power Supply Rejection Ratio VDD = 5V, Input Grounded = 10Ω Output Load = 8Ω, 200mV Ripple LM4890 vs LM4877 Power Supply Rejection Ratio VDD = 3V, Input Grounded = 10Ω Output Load = 8Ω, 200mV Ripple Figure 38. LM4890 = Bottom Trace LM4877 = Top Trace Figure 39.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) 14 Power Output vs Supply Voltage Power Output vs Temperature Figure 44. Figure 45. Power Dissipation vs Output Power VDD = 5V, 1kHz, 8Ω, THD ≤ 1.0% Power Dissipation vs Output Power VDD = 3.3V, 1kHz, 8Ω, THD ≤ 1.0% Figure 46. Figure 47. Power Dissipation vs Output Power VDD = 2.6V, 1kHz Output Power vs Load Resistance Figure 48. Figure 49.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Typical Performance Characteristics (continued) Supply Current vs Ambient Temperature Clipping (Dropout) Voltage vs Supply Voltage Figure 50. Figure 51. Max Die Temp at PDMAX (9 bump DSBGA) Max Die Temp at PDMAX (8 bump DSBGA) Figure 52. Figure 53. Output Offset Voltage Supply Current vs Shutdown Voltage Figure 54. Figure 55.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) Shutdown Hysterisis Voltage VDD = 5V 4 Shutdown Hysterisis Voltage VDD = 3V 4 SUPPLY CURRENT (MA) 2 OFF ON 1 0 3 2 OFF 0 0 1 2 0 3 1 Shutdown Voltage (V) Figure 57. Open Loop Frequency Response VDD = 5V, No Load Open Loop Frequency Response VDD = 3V, No Load Figure 58. Figure 59.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Typical Performance Characteristics (continued) Phase Margin vs CLOAD, AV = 2 VDD = 5V, 8Ω Load Capacitance to gnd on each output Phase Margin vs CLOAD, AV = 4 VDD = 5V, 8Ω Load Capacitance to gnd on each output 100 100 80 80 PHASE (°) 120 PHASE (°) 120 60 50 deg Stability Limit 40 50 deg Stability Limit 40 20 0 60 20 0 500 1000 1500 0 2000 0 CAPACITANCE (pF) Figure 62. 1000 500 1500 CAPACITANCE (pF) 2000 Figure 63.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Typical Performance Characteristics (continued) Wake Up Time (TWU) Frequency Response vs Input Capacitor Size Figure 65. Figure 66. Noise Floor Figure 67.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 APPLICATION INFORMATION BRIDGED CONFIGURATION EXPLANATION As shown in Figure 7, the LM4890 has two operational amplifiers internally, allowing for a few different amplifier configurations. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in a unity-gain, inverting configuration.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com POWER SUPPLY BYPASSING As with any amplifier, proper supply bypassing is critical for low noise performance and high power supply rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as possible. Typical applications employ a 5V regulator with 10 µF tantalum or electrolytic capacitor and a ceramic bypass capacitor which aid in supply stability.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 In addition to system cost and size, click and pop performance is effected by the size of the input coupling capacitor, CIN. A larger input coupling capacitor requires more charge to reach its quiescent DC voltage (nominally 1/2 VDD). This charge comes from the output via the feedback and is apt to create pops upon device enable. Thus, by minimizing the capacitor size based on necessary low frequency response, turn-on pops can be minimized.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com The high frequency pole is determined by the product of the desired frequency pole, fH, and the differential gain, AVD. With a AVD = 3 and fH = 100kHz, the resulting GBWP = 300kHz which is much smaller than the LM4890 GBWP of 2.5MHz. This calculation shows that if a designer has a need to design an amplifier with a higher differential gain, the LM4890 can still be used without running into bandwidth limitations. Figure 68.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Figure 69. DIFFERENTIAL AMPLIFIER CONFIGURATION FOR LM4890 Figure 70.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Figure 71. REFERENCE DESIGN BOARD and PCB LAYOUT GUIDELINES - VSSOP and SOIC Boards LM4890 SOIC DEMO BOARD ARTWORK Figure 72. Silk Screen Figure 73.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com Figure 74. Bottom Layer LM4890 VSSOP DEMO BOARD ARTWORK Figure 75. Silk Screen Figure 76. Top Layer Figure 77. Bottom Layer Table 1.
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LM4890 www.ti.com SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 Table 1. Mono LM4890 Reference Design Boards Bill of Material for all 3 Demo Boards (continued) Bill of Material for all 3 Demo Boards Item Part Number 1 551011208-001 LM4890 Mono Reference Design Board Part Description Qty 1 Ref Designator 10 482911183-001 LM4890 Audio AMP 1 U1 20 151911207-001 Tant Cap 1uF 16V 10 1 C1 21 151911207-002 Cer Cap 0.
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LM4890 SNAS138L – SEPTEMBER 2001 – REVISED MAY 2013 www.ti.com REVISION HISTORY Changes from Revision K (May 2013) to Revision L • 28 Page Changed layout of National Data Sheet to TI format ..........................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM4890LDX/NOPB WSON NGZ 10 4500 330.0 12.4 4.3 3.3 1.0 8.0 12.0 Q1 LM4890MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM4890MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM4890LDX/NOPB WSON NGZ 10 4500 367.0 367.0 35.0 LM4890MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM4890MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM4890MX/NOPB SOIC D 8 2500 367.0 367.0 35.
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MECHANICAL DATA NGZ0010B LDA10B (Rev B) www.ti.
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