Datasheet

LM4889
SNAS157H –APRIL 2002–REVISED MAY 2013 www.ti.com
Typical Application
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagram
Figure 2. Small Outline (SOIC) Package - Top View Figure 3. Mini Small Outline (VSSOP) Package –
Top View
See Package Number D
See Package Number DGK
Figure 4. 8-Bump DSBGA - Top View Figure 5. WSON Package - Top View
See Package Number YZR0008 See Package Number NGZ
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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