Datasheet

3
2
1
CPN
CPVSS
INL
INR
SHDN
PGND
VSS
COM
CPP
V
DD
OUTL
OUTR
A
B
C
0.4 mm TYP
0.4 mm TYP
D
LM48861, LM48861TMBD
www.ti.com SNAS450B –JUNE 2008–REVISED MAY 2013
Connection Diagrams
Figure 2. YFQ Package
1.215mm x 1.615mm x 0.6mm
Top View
See Package Number YFQ0012AAA
BUMP DESCRIPTION
Bump Name Description
A1 CPP Charge Pump Flying Capacitor Positive Terminal
A2 PGND Power Ground
A3 CPN Charge Pump Flying Capacitor Negative Terminal
B1 V
DD
Positive Power Supply
B2 SHDN Active Low Shutdown
B3 CPV
SS
Charge Pump Output
C1 OUTL Left Channel Output
C2 V
SS
Negative Power Supply
C3 INL Left Channel Input
D1 OUTR Right Channel Output
D2 COM Ground reference for inputs and HP
D3 INR Right Channel Input
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Product Folder Links: LM48861 LM48861TMBD