Datasheet

LM4871
www.ti.com SNAS002F –FEBRUARY 2000–REVISED MAY 2013
Typical Performance Characteristics
NGN Specific Characteristics
LM4871LD THD+N vs Output Power LM4871LD THD+N vs Frequency
Figure 4. Figure 5.
LM4871LD THD+N vs Frequency LM4871LD THD+N vs Output Power
Figure 6. Figure 7.
LM4871LD Power Dissipation vs Output Power LM4871LD Power Derating Curve
This curve shows the LM4871LD's thermal dissipation ability at
different ambient temperatures given the exposed-DAP of the part is
soldered to a plane of 1oz. Cu with an area given in the label of each
curve. This label also designates whether the plane exists on the
same (top) layer as the chip, on the bottom layer, or on both layers.
Infinite heatsink and unattached (no heatsink) conditions are also
shown.
Figure 8. Figure 9.
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