Datasheet

LM4864
www.ti.com SNAS109F –SEPTEMBER 1999–REVISED MAY 2013
Figure 4. DIE LAYOUT (B-STEP)
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to V
DD
+ 0.3V
Power Dissipation
(3)
Internally limited
ESD Susceptibility
(4)
2000V
ESD Susceptibility
(5)
200V
Junction Temperature 150°C
Vapor Phase (60 sec.) 215°C
Soldering
Small Outline Package
Information
Infrared (15 sec.) 220°C
θ
JC
(VSSOP) 56° C/W
θ
JA
(VSSOP) 210°C/W
θ
JC
(SOIC) 35°C/W
θ
JA
(SOIC) 170°C/W
Thermal Resistance
θ
JC
(PDIP)
*
37°C/W
θ
JA
(PDIP)
*
107°C/W
θ
JA
(WSON)
(6)
63°C/W
θ
JC
(WSON)
(6)
12°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
, θ
JA
, and the ambient temperature
T
A
. The maximum allowable power dissipation is P
DMAX
= (T
JMAX
− T
A
)/θ
JA
or the number given in the Absolute Maximum Ratings,
whichever is lower. For the LM4864, T
JMAX
= 150°C. The typical junction-to-ambient thermal resistance, when board mounted, is
230°C/W for package number DGK0008A, 170°C/W for package number D0008A and is 107°C/W for package number P0008E
*
.
(4) Human body model, 100pF discharged through a 1.5kΩ resistor.
(5) Machine Model, 220pF – 240pF discharged through all pins.
(6) The NGY0010A package has its exposed-DAP soldered to an exposed 1.2in
2
area of 1oz printed circuit board copper.
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