Datasheet

LM4819, LM4819MBD
www.ti.com SNAS133D –FEBRUARY 2001–REVISED MARCH 2013
Absolute Maximum Ratings
(1)(2)(3)
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to V
DD
+0.3V
Power Dissipation (P
D
)
(4)
Internally Limited
ESD Susceptibility
(5)
3.5kV
ESD Susceptibility
(6)
250V
Junction Temperature (T
J
) 150°C
Soldering Information Small Outline Package Vapor Phase (60 seconds) 215°C
Infrared (15 seconds) 220°C
Thermal Resistance θ
JC
(VSSOP) 56°C/W
θ
JA
(VSSOP) 210°C/W
θ
JC
(SOIC) 35°C/W
θ
JA
(SOIC) 170°C/W
θ
JA
(WSON) 117°C/W
(7)
θ
JA
(WSON) 150°C/W
(8)
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given. However, the typical value is a good indication
of device's performance.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(4) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
, θ
JA
, and the ambient temperature
T
A
. The maximum allowable power dissipation is P
DMAX
= (T
JMAX
–T
A
)/θ
JA
. For the LM4819, T
JMAX
= 150°C and the typical junction-to-
ambient thermal resistance (θ
JA
) when board mounted is 210°C/W for the VSSOP package and 170°C/W for the SOIC package.
(5) Human body model, 100pF discharged through a 1.5 kΩ resistor.
(6) Machine Model, 220pF–240pF capacitor is discharged through all pins.
(7) The given θ
JA
is for an LM4819 package in an NGL0008B with the Exposed-DAP soldered to a printed circuit board copper pad with an
area equivalent to that of the Exposed-DAP itself. The Exposed-DAP of the NGL0008B package should be electrically connected to
GND or an electrically isolated copper area.
(8) The given θ
JA
is for an LM4819 package in an NGL0008B with the Exposed-DAP not soldered to any printed circuit board copper.
Operating Ratings
(1)(2)
Temperature Range
−40°C ≤ T
A
≤ 85°C
T
MIN
≤ T
A
≤ T
MAX
Supply Voltage 2.0V ≤ V
CC
≤ 5.5V
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given. However, the typical value is a good indication
of device's performance.
Copyright © 2001–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM4819 LM4819MBD