Datasheet

LM4808
www.ti.com SNAS051D –FEBRUARY 2000–REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)(2)
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to V
DD
+ 0.3V
Power Dissipation
(3)
Internally limited
ESD Susceptibility
(4)
3500V
ESD Susceptibility
(5)
250V
Junction Temperature 150°C
Vapor Phase (60 seconds) 215°C
Soldering Information
(6)
Small Outline Package
Infrared (15 seconds) 220°C
θ
JC
(VSSOP) 56°C/W
θ
JA
(VSSOP) 210°C/W
θ
JC
(SOIC) 35°C/W
Thermal Resistance θ
JA
(SOIC) 170°C/W
θ
JC
(WSON) 15°C/W
θ
JA
(WSON) 117°C/W
(7)
θ
JA
(WSON) 150°C/W
(8)
(1) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
, θ
JA
, and the ambient temperature
T
A
. The maximum allowable power dissipation is P
DMAX
= (T
JMAX
− T
A
) / θ
JA
. For the LM4808, T
JMAX
= 150°C, and the typical junction-
to-ambient thermal resistance, when board mounted, is 210°C/W for package DGK0008A and 170°C/W for package D0008A.
(4) Human body model, 100 pF discharged through a 1.5 kΩ resistor.
(5) Machine Model, 220 pF–240 pF discharged through all pins.
(6) See http://www.ti.com for other methods of soldering surface mount devices.
(7) The given θ
JA
is for an LM4808 packaged in an NGL0008B with the Exposed-DAP soldered to a printed circuit board copper pad with an
area equivalent to that of the Exposed-DAP itself.
(8) The given θ
JA
is for an LM4808 packaged in an NGL0008B with the Exposed-DAP not soldered to any printed circuit board copper.
OPERATING RATINGS
Temperature Range T
MIN
≤ T
A
≤ T
MAX
−40°C ≤ T
A
≤ 85°C
Supply Voltage 2.0V ≤ V
DD
≤ 5.5V
ELECTRICAL CHARACTERISTICS
(1) (2)
The following specifications apply for V
DD
= 5V unless otherwise specified, limits apply to T
A
= 25°C.
Symbol Parameter Conditions LM4808 Units
(Limits)
Typ
(3)
Limit
(4)
2.0 V (min)
V
DD
Supply Voltage
5.5 V (max)
I
DD
Supply Current V
IN
= 0V, I
O
= 0A 1.2 3.0 mA (max)
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Tested limits are specified to AOQL (Average Outgoing Quality Level). Datasheet min/max specification limits are specified by design,
test, or statistical analysis.
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