Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Audio amplifier Headphones (2-channel, stereo) Class AB SOIC 8

LM4808

www.ti.com

SNAS051D –FEBRUARY 2000–REVISED MAY 2013

LM4808

Low Voltage High Power Audio Power Amplifier

Check for Samples: LM4808

FEATURES

DESCRIPTION

The LM4808 is a dual audio power amplifier capable

• WSON, VSSOP, and SOIC Surface Mount

of delivering 105mW per channel of continuous

Packaging

average power into a 16Ω load with 0.1% (THD+N)

• Switch On/Off Click Suppression

from a 5V power supply.

• Excellent Power Supply Ripple Rejection

Boomer audio power amplifiers were designed

• Unity-Gain Stable

specifically to provide high quality output power with a

minimal amount of external components using

• Minimum External Components

surface mount packaging. Since the LM4808 does

not require bootstrap capacitors or snubber networks,

APPLICATIONS

it is optimally suited for low-power portable systems.

• Headphone Amplifier

The unity-gain stable LM4808 can be configured by

• Personal Computers

external gain-setting resistors.

• Portable Electronic Devices

KEY SPECIFICATIONS

• THD+N at 1kHz at 105mW Continuous Average

Output Power Into 16Ω 0.1 % (typ)

• THD+N at 1kHz at 70mW Continuous Average

Output Power Into 32Ω 0.1 % (typ)

• Output Power at 0.1% THD+N at 1kHz Into 32Ω

70 mW (typ)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (24 pages)

PAGE 1
LM4808 www.ti.com SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 LM4808 Low Voltage High Power Audio Power Amplifier Check for Samples: LM4808 FEATURES DESCRIPTION • The LM4808 is a dual audio power amplifier capable of delivering 105mW per channel of continuous average power into a 16Ω load with 0.1% (THD+N) from a 5V power supply.
PAGE 2
LM4808 SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com Typical Application *Refer to the APPLICATION INFORMATION section for information concerning proper selection of the input and output coupling capacitors. Figure 1. Typical Audio Amplifier Application Circuit Connection Diagram Figure 2. Top View WSON Package See Package Number NGL0008B Figure 3.
PAGE 3
LM4808 www.ti.com SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) Supply Voltage 6.0V −65°C to +150°C Storage Temperature −0.3V to VDD + 0.
PAGE 4
LM4808 SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS (1) (2) (continued) The following specifications apply for VDD = 5V unless otherwise specified, limits apply to TA = 25°C. Symbol Parameter Conditions LM4808 Typ (3) Limit (4) Units (Limits) Ptot Total Power Dissipation VIN = 0V, IO = 0A 6 16.
PAGE 5
LM4808 www.ti.com SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 ELECTRICAL CHARACTERISTICS (1) (2) (continued) The following specifications apply for VDD = 3.3V unless otherwise specified, limits apply to TA = 25°C. Symbol Parameter Conditions Conditions (3) Typ Limit (4) Units (Limits) THD+N = 0.
PAGE 6
LM4808 SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS 6 THD+N vs Frequency THD+N vs Frequency Figure 4. Figure 5. THD+N vs Frequency THD+N vs Frequency Figure 6. Figure 7. THD+N vs Frequency THD+N vs Frequency Figure 8. Figure 9.
PAGE 7
LM4808 www.ti.com SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) THD+N vs Frequency THD+N vs Frequency Figure 10. Figure 11. THD+N vs Frequency THD+N vs Frequency Figure 12. Figure 13. THD+N vs Output Power THD+N vs Output Power Figure 14. Figure 15.
PAGE 8
LM4808 SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) 8 THD+N vs Output Power THD+N vs Output Power Figure 16. Figure 17. THD+N vs Output Power THD+N vs Output Power Figure 18. Figure 19. THD+N vs Output Power THD+N vs Output Power Figure 20. Figure 21.
PAGE 9
LM4808 www.ti.com SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) THD+N vs Output Power Output Power vs Load Resistance Figure 22. Figure 23. Output Power vs Load Resistance Output Power vs Load Resistance Figure 24. Figure 25. Output Power vs Supply Voltage Output Power vs Power Supply Figure 26. Figure 27.
PAGE 10
LM4808 SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) 10 Output Power vs Power Supply Clipping Voltage vs Supply Voltage Figure 28. Figure 29. Power Dissipation vs Output Power Power Dissipation vs Output Power Figure 30. Figure 31. Power Dissipation vs Output Power Channel Separation Figure 32. Figure 33.
PAGE 11
LM4808 www.ti.com SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 TYPICAL PERFORMANCE CHARACTERISTICS (continued) Channel Separation Noise Floor Figure 34. Figure 35. Power Supply Rejection Ratio Frequency Response Figure 36. Figure 37. Open Loop Frequency Response Open Loop Frequency Response Figure 38. Figure 39.
PAGE 12
LM4808 SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com TYPICAL PERFORMANCE CHARACTERISTICS (continued) 12 Supply Current vs Supply Voltage Frequency Response vs Output Capacitor Size Figure 40. Figure 41. Frequency Response vs Output Capacitor Size Frequency Response vs Output Capacitor Size Figure 42. Figure 43. Typical Application Frequency Response Typical Application Frequency Response Figure 44. Figure 45.
PAGE 13
LM4808 www.ti.com SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 APPLICATION INFORMATION EXPOSED-DAP PACKAGE PCB MOUNTING CONSIDERATION The LM4808's exposed-dap (die attach paddle) package (LD) provides a low thermal resistance between the die and the PCB to which the part is mounted and soldered. This allows rapid heat transfer from the die to the surrounding PCB copper traces, ground plane, and surrounding air. The LD package should have its DAP soldered to a copper pad on the PCB.
PAGE 14
LM4808 SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com SELECTING PROPER EXTERNAL COMPONENTS Optimizing the LM4808's performance requires properly selecting external components. Though the LM4808 operates well when using external components with wide tolerances, best performance is achieved by optimizing component values. The LM4808 is unity-gain stable, giving a designer maximum design flexibility. The gain should be set to no more than a given application requires.
PAGE 15
LM4808 www.ti.com SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 AUDIO POWER AMPLIFIER DESIGN Design a Dual 70mW/32Ω Audio Amplifier Given: Power Output 70mW Load Impedance 32Ω Input Level 1Vrms (max) Input Impedance 20kΩ Bandwidth 100Hz–20kHz ± 0.50dB The design begins by specifying the minimum supply voltage necessary to obtain the specified output power.
PAGE 16
LM4808 SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 www.ti.com The high frequency pole is determined by the product of the desired high frequency pole, fH, and the closed-loop gain, AV. With a closed-loop gain of 1.5 and fH = 100kHz, the resulting GBWP = 150kHz which is much smaller than the LM4808's GBWP of 900kHz. This figure displays that if a designer has a need to design an amplifier with a higher gain, the LM4808 can still be used without running into bandwidth limitations.
PAGE 17
LM4808 www.ti.com SNAS051D – FEBRUARY 2000 – REVISED MAY 2013 REVISION HISTORY Changes from Revision C (May 2013) to Revision D • Page Changed layout of National Data Sheet to TI format ..........................................................................................................
PAGE 18
PACKAGE OPTION ADDENDUM www.ti.
PAGE 19
PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 20
PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM4808MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM4808MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM4808MX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.
PAGE 21
PACKAGE MATERIALS INFORMATION www.ti.com 8-May-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM4808MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM4808MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0 LM4808MX/NOPB SOIC D 8 2500 367.0 367.0 35.
PAGE 22
PAGE 23
PAGE 24
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.