Datasheet
LM4671
www.ti.com
SNAS258D –MARCH 2005–REVISED MAY 2013
Absolute Maximum Ratings
(1)(2)(3)
Supply Voltage
(1)
6.0V
Storage Temperature −65°C to +150°C
Voltage at Any Input Pin V
DD
+ 0.3V ≥ V ≥ GND - 0.3V
Power Dissipation
(4)
Internally Limited
ESD Susceptibility, all other pins
(5)
2.0kV
ESD Susceptibility
(6)
200V
Junction Temperature (T
JMAX
) 150°C
Thermal Resistance θ
JA
(DSBGA) 220°C/W
Soldering Information
See AN-1112 "MicroSMD Wafers Level Chip Scale Package" (Literature Number SNVA009)
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) The maximum power dissipation must be derated at elevated temperatures and is dictated by T
JMAX
, θ
JA
, and the ambient temperature
T
A
. The maximum allowable power dissipation is P
DMAX
= (T
JMAX
–T
A
)/θ
JA
or the number given in Absolute Maximum Ratings, whichever
is lower. For the LM4671, T
JMAX
= 150°C. The typical θ
JA
is 220°C/W for the DSBGA package.
(5) Human body model, 100pF discharged through a 1.5kΩ resistor.
(6) Machine Model, 220pF–240pF discharged through all pins.
Operating Ratings
(1)(2)
Temperature Range T
MIN
≤ T
A
≤ T
MAX
−40°C ≤ T
A
≤ 85°C
Supply Voltage 2.4V ≤ V
DD
≤ 5.5V
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
Electrical Characteristics
(1)(2)
The following specifications apply for A
V
= 2V/V (R
I
= 150kΩ), R
L
= 15µH + 8Ω + 15µH unless otherwise specified. Limits
apply for T
A
= 25°C.
LM4671
Units
Symbol Parameter Conditions
(Limits)
Typical
(3)
Limit
(4) (5)
V
I
= 0V, A
V
= 2V/V,
|V
OS
| Differential Output Offset Voltage 5 mV (max)
V
DD
= 2.4V to 5.0V
PSRR
GSM
GSM Power Supply Rejection Ratio V
DD
= 2.4V to 5.0V 61 dB (min)
V
DD
= 2.4V to 5.0V
CMRR
GSM
GSM Common Mode Rejection Ratio V
IC
= V
DD
/2 to 0.5V, 68 dB (min)
V
IC
= V
DD
/2 to V
DD
– 0.8V
|I
IH
| Logic High Input Current V
DD
= 5.0V, V
I
= 5.5V 17 100 μA (max)
|I
IL
| Logic Low Input Current V
DD
= 5.0V, V
I
= –0.3V 0.9 5 μA (max)
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typical specifications are specified at 25°C and represent the parametric norm.
(4) Tested limits are specified to AOQL (Average Outgoing Quality Level).
(5) Datasheet min/max specification limits are specified by design, test, or statistical analysis.
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