Datasheet
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM431AIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM431AIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM431BCM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM431BCM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM431BCM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM431BCMX SOIC D 8 2500 367.0 367.0 35.0
LM431BCMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM431BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM431BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM431BIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM431BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM431BIMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LM431CCM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM431CCM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM431CCM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM431CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM431CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM431CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM431CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 3