Datasheet

CATHODE
ANODE
_
+
LM4040-EP
SLOS746A – SEPTEMBER 2011– REVISED SEPTEMBER 2011 www.ti.com
FUNCTIONAL BLOCK DIAGRAM
Absolute Maximum Ratings
(1)
over free-air temperature range (unless otherwise noted)
MIN MAX UNIT
I
Z
Continuous cathode current –10 25 mA
T
J
Operating virtual junction temperature 150 °C
T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
LM4040
THERMAL METRIC
(1)
DBZ UNITS
3 PINS
θ
JA
Junction-to-ambient thermal resistance
(2)
320.8
θ
JC
Junction-to-case thermal resistance 98.2
θ
JB
Junction-to-board thermal resistance
(3)
53.3 °C/W
ψ
JT
Junction-to-top characterization parameter
(4)
3.3
ψ
JB
Junction-to-board characterization parameter
(5)
51.8
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(4) The junction-to-top characterization parameter, ψ
JT
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
(5) The junction-to-board characterization parameter, ψ
JB
, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θ
JA
, using a procedure described in JESD51-2a (sections 6 and 7).
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