Datasheet

LM4030
SNVS552B –MARCH 2008–REVISED APRIL 2013 www.ti.com
PIN DESCRIPTIONS
Pin # Name Function
1 N/C No connect pin, leave floating
2 GND, N/C Ground or no connect
3 N/C No connect pin, leave floating
4 VREF Reference voltsge
5 GND Ground
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Maximum Voltage on any input -0.3 to 6V
Power Dissipation (T
A
= 25°C)
(3)
350mW
Storage Temperature Range −65°C to 150°C
Lead Temperature (soldering, 10sec) 260°C
Vapor Phase (60 sec) 215°C
Infrared (15sec) 220°C
ESD Susceptibility
(4)
Human Body Model 2kV
(1) Absolute Maximum Ratings indicate limits beyond which damage may occur to the device. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Without PCB copper enhancements. The maximum power dissipation must be de-rated at elevated temperatures and is limited by T
JMAX
(maximum junction temperature), θ
J-A
(junction to ambient thermal resistance) and T
A
(ambient temperature). The maximum power
dissipation at any temperature is: P
DissMAX
= (T
JMAX
- T
A
) /θ
J-A
up to the value listed in the Absolute Maximum Ratings. θ
J-A
for SOT-23
package is 220°C/W, T
JMAX
= 125°C.
(4) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Operating Ratings
Maximum Continuous Shunt Current 30mA
Maximum Shunt Current (<1s) 50mA
Junction Temperature Range (T
J
) −40°C to +125°C
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