Datasheet

Figure 23-10. Hibernation Module Timing ................................................................................. 758
Figure 23-11. ADC Input Equivalency Diagram ......................................................................... 759
Figure 23-12. SSI Timing for TI Frame Format (FRF=01), Single Transfer Timing
Measurement .................................................................................................... 760
Figure 23-13. SSI Timing for MICROWIRE Frame Format (FRF=10), Single Transfer ................. 760
Figure 23-14. SSI Timing for SPI Frame Format (FRF=00), with SPH=1 ..................................... 761
Figure 23-15. I
2
C Timing ......................................................................................................... 762
Figure 23-16. External XTLP Oscillator Characteristics ............................................................. 764
Figure D-1. Stellaris LM3S8962 100-Pin LQFP Package Dimensions ..................................... 799
Figure D-2. 100-Pin LQFP Tray Dimensions .......................................................................... 801
Figure D-3. 100-Pin LQFP Tape and Reel Dimensions ........................................................... 802
Figure D-4. Stellaris LM3S8962 108-Ball BGA Package Dimensions ...................................... 803
Figure D-5. 108-Ball BGA Tray Dimensions ........................................................................... 805
Figure D-6. 108-Ball BGA Tape and Reel Dimensions ............................................................ 806
13June 18, 2012
Texas Instruments-Production Data
Stellaris
®
LM3S8962 Microcontroller
NRND: Not recommended for new designs.