Datasheet
LM397
SNOS977D –MAY 2001–REVISED MARCH 2013
www.ti.com
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2KV
Machine Model 200V
V
IN
Differential 30V
Supply Voltages 30V or ±15V
Voltage at Input Pins −0.3V to 30V
Storage Temperature Range −65°C to +150°C
Junction Temperature
(4)
+150°C
Soldering Information Infrared or Convection (20 sec.) 235°C
Wave Soldering (10 sec.) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
Operating Ratings
(1)
Supply Voltage, V
S
5V to 30V
Temperature Range
(2)
−40°C to +85°C
Package Thermal Resistance
(2)
5-Pin SOT-23 168°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
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