Datasheet

LM3691
www.ti.com SNVS506I –MAY 2008–REVISED MAY 2013
Absolute Maximum Ratings
(1)(2)
V
IN
Pin to GND −0.2V to 6.0V
EN, MODE, FB, SW pins (GND−0.2V) to
V
IN
+ 0.2V
Junction Temperature (T
J-MAX
) +150°C
Storage Temperature Range −65°C to +150°C
Continuous Power Dissipation
(3)
Internally Limited
Maximum Lead Temperature 260°C
(Soldering, 10 sec.)
ESD Rating
(4)
Human Body Model 2 kV
Machine Model 200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 150°C (typ.) and
disengages at T
J
= 130°C (typ.).
(4) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
Operating Ratings
(1) (2)
Input Voltage Range 2.3V to 5.5V
Recommended Load Current 0 mA to 1000 mA
Junction Temperature (T
J
) Range −30°C to +125°C
Ambient Temperature (T
A
) Range
(3)
−30°C to +85°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is specified. Operating Ratings do not imply performance limits. For performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) All voltages are with respect to the potential at the GND pin.
(3) In applications where high power dissipation and/or poor package resistance is present, the maximum ambient temperature may have to
be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX
), the
maximum power dissipation of the device in the application (P
D-MAX
) and the junction to ambient thermal resistance of the package (θ
JA
)
in the application, as given by the following equation: T
A-MAX
= T
J-MAX
− (θ
JA
x P
D-MAX
). Due to the pulsed nature of testing the part, the
temp in the Electrical Characteristic table is specified as T
A
= T
J
.
Thermal Properties
Junction-to-Ambient Thermal Resistance (θ
JA
)
(1)
(DSBGA) 85°C/W
(1) Junction-to-ambient thermal resistance is highly application and board layout dependent. In applications where high power dissipation
exists, special care must be given to thermal dissipation issues in board design.
Copyright © 2008–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LM3691