Datasheet

LM3674
SNVS405F –DECEMBER 2005–REVISED MAY 2013 www.ti.com
Absolute Maximum Ratings
(1)(2)
V
IN
Pin: Voltage to GND −0.2V to 6.0V
EN, FB, SW Pin: (GND−0.2V) to
(V
IN
+ 0.2V)
Continuous Power Dissipation
(3)
Internally Limited
Junction Temperature (T
J-MAX
) +125°C
Storage Temperature Range −65°C to +150°C
Maximum Lead Temperature 260°C
(Soldering, 10 sec.)
ESD Rating
(4)
2 kV
Human Body model: All Pins
Machine Model: All Pins 200V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings may not imply performance limits. For performance limits and associated
test conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) In Applications where high power dissipation and /or poor package resistance is present, the maximum ambient temperature may have
to be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX
), the
maximum power dissipation of the device in the application (P
D-MAX
) and the junction to ambient thermal resistance of the package (θ
JA
)
in the application, as given by the following equation: T
A-MAX
= T
J-MAX
- (θ
JA
x P
D-MAX
). Refer to Dissipation ration table for P
D-MAX
values
at different ambient temperatures.
(4) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin (MIL-STD-883 3015.7). National Semiconductor recommends that all intergrated circuits be
handled with appropriate precautions. Failure to observe proper ESD handling techniques can result in damage.
Operating Ratings
(1)(2)(3)
Input Voltage Range
(4)
2.7V to 5.5V
Recommended Load Current 0A to 600 mA
Junction Temperature (T
J
) Range −30°C to +125°C
Ambient Temperature (T
A
) Range −30°C to +85°C
(1) In Applications where high power dissipation and /or poor package resistance is present, the maximum ambient temperature may have
to be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX
), the
maximum power dissipation of the device in the application (P
D-MAX
) and the junction to ambient thermal resistance of the package (θ
JA
)
in the application, as given by the following equation: T
A-MAX
= T
J-MAX
- (θ
JA
x P
D-MAX
). Refer to Dissipation ration table for P
D-MAX
values
at different ambient temperatures.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings may not imply performance limits. For performance limits and associated
test conditions, see the Electrical Characteristics tables.
(3) All voltages are with respect to the potential at the GND pin.
(4) Input voltage range recommended for ideal applications performance for the specified output voltages are given below
V
IN
= 2.7V to 5.5V for 1.0V ≤ V
OUT
< 1.8V
V
IN
= ( V
OUT
+ V
DROP OUT
) to 5.5V for 1.8 ≤ V
OUT
≤ 3.3V Where V
DROP OUT
= I
LOAD
* (R
DSON (P)
+ R
INDUCTOR
)
Thermal Properties
(1)
over operating free-air temperature range (unless otherwise noted)
Junction-to-Ambient Thermal Resistance (θ
JA
) (SOT-23) for a 2 layer board
(2)
250°C/W
Junction-to-Ambient Thermal Resistance (θ
JA
) (SOT-23) for a 4 layer board
(2)
130°C/W
(1) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
J
= 150°C (typ.) and
disengages at T
J
= 130°C
(2) Junction to ambient thermal resistance (θ
JA
) is highly application and board layout dependent. In applications where high power
dissipation exists, special care must be given to thermal dissipation issues in board design. Value specified here 250°C/W is based on
measurement results using a 2 layer, 4" X 3", 2 oz. Cu board as per JEDEC standards. The θ
JA
is 130°C/W if a 4 layer, 4" X 3", 2/1/1/2
oz. Cu board as per JEDEC standards is used.
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