Datasheet

LM3668
SNVS449M –JUNE 2007–REVISED MAY 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)(2)(3)
PV
IN
, VDD, SW1, SW2 & VOUT Pins: Voltage to SGND & PGND −0.2V to +6.0V
FB, EN, and MODE/SYNC pins (PGND & SGND-0.2V) to (PV
IN
+ 0.2)
PGND to SGND –0.2V to 0.2V
Continuous Power Dissipation
(4)
Internally Limited
Maximum Junction Temperature (T
J-MAX
) +125°C
Storage Temperature Range −65°C to +150°C
Maximum Lead Temperature (Soldering, 10 sec) +260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits
and associated test conditions, see the Electrical Characteristics tables.
(2) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. The machine model is a 200 pF
capacitor discharged directly into each pin. MIL-STD-883 3015.7
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(4) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125ºC), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
OPERATING RATINGS
Input Voltage Range 2.5V to 5.5V
Recommended Load Current 0mA to 1A
Junction Temperature (T
J
) Range −40°C to +125°C
Ambient Temperature (T
A
) Range
(1)
−40°C to +85° C
(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (T
A-MAX
) is dependent on the maximum operating junction temperature (T
J-MAX-OP
=
125ºC), the maximum power dissipation of the device in the application (P
D-MAX
), and the junction-to ambient thermal resistance of the
part/package in the application (θ
JA
), as given by the following equation: T
A-MAX
= T
J-MAX-OP
– (θ
JA
× P
D-MAX
).
THERMAL PROPERTIES
Junction-to-Ambient Thermal Resistance (θ
JA
) 34°C/W
WSON Package
(1)
(1) Junction-to-ambient thermal resistance (θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 101.6 mm x 76.2 mm x 1.6 mm. Thickness of
the copper layers are 2oz/1oz/1oz/2oz. The middle layer of the board is 60mm x 60mm. Ambient temperature in simulation is 22°C, still
air. Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special care must be paid to thermal dissipation issues in board design.
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