Datasheet

7
LM158, LM158A , LM258 , LM258A
LM358 , LM358A , LM358B , LM2904 , LM2904B , LM2904V
www.ti.com SLOS068V –JUNE 1976–REVISED SEPTEMBER 2018
Product Folder Links: LM158 LM258 LM258A LM358 LM358A LM358B LM2904 LM2904B LM2904V
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7.3 Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MIN MAX UNIT
V
S
Supply voltage, V
S
= ([V+] – [V–])
LM358B, LM358BA, LM2904B,
LM2904BA
3 36
VLM158, LM258, LM358, LM158A,
LM258A, LM358A, LM2904V
3 30
LM2904 3 26
V
CM
Common-mode voltage V– V
S
– 2 V
T
A
Operating ambient temperature
LM358B, LM358BA –40 85
°C
LM2904B, LM2904BA, LM2904,
LM2904V
–40 125
LM358, LM358A 0 70
LM258, LM258A –20 85
LM158, LM158A –55 125
(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.
(2) For a listing of which devices are available in what packages, see Device Comparison Table
7.4 Thermal Information
THERMAL METRIC
(1)
LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904,
LM2904B, LM2904BA, LM2904V
(2)
LM158, LM158A
UNITD
(SOIC)
DGK
(VSSOP)
P
(PDIP)
PS
(SO)
PW
(TSSOP)
FK
(LCCC)
JG
(CDIP)
8 PINS 8 PINS 8 PINS 8 PINS 8 PINS 20 PINS 8 PINS
R
θJA
Junction-to-ambient thermal
resistance
124.7 181.4 80.9 116.9 171.7 — — °C/W
R
θJC(top)
Junction-to-case (top)
thermal resistance
66.9 69.4 70.4 62.5 68.8 5.61 14.5 °C/W
R
θJB
Junction-to-board thermal
resistance
67.9 102.9 57.4 68.6 99.2 — — °C/W
ψ
JT
Junction-to-top
characterization parameter
19.2 11.8 40 21.9 11.5 — — °C/W
ψ
JB
Junction-to-board
characterization parameter
67.2 101.2 56.9 67.6 97.9 — — °C/W
R
θJC(bot)
Junction-to-case (bottom)
thermal resistance
— — — — — 12.1 — °C/W