Datasheet

Device Package
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
(mm)
Pin1
Quadrant
LM358PWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358PWRG4-JF TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM258ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM258ADR SOIC D 8 2500 340.5 338.1 20.6
LM258ADR SOIC D 8 2500 367.0 367.0 35.0
LM258ADR SOIC D 8 2500 364.0 364.0 27.0
LM258ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM258ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM258DGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM258DR SOIC D 8 2500 367.0 367.0 35.0
LM258DR SOIC D 8 2500 340.5 338.1 20.6
LM258DR SOIC D 8 2500 364.0 364.0 27.0
LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM258DRG3 SOIC D 8 2500 333.2 345.9 28.6
LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Oct-2018
Pack Materials-Page 3