Datasheet

LM34910C
SNVS517B MAY 2007REVISED MARCH 2013
www.ti.com
PC BOARD LAYOUT
The LM34910C regulation, over-voltage, and current limit comparators are very fast, and respond to short
duration noise pulses. Layout considerations are therefore critical for optimum performance. The layout must be
as neat and compact as possible, and all of the components must be as close as possible to their associated
pins. The current loop formed by D1, L1, C2 and the S
GND
and I
SEN
pins should be as small as possible. The
ground connection from C2 to C1 should be as short and direct as possible.
If it is expected that the internal dissipation of the LM34910C will produce excessive junction temperatures during
normal operation, good use of the PC board’s ground plane can help considerably to dissipate heat. The
exposed pad on the bottom of the IC package can be soldered to a ground plane, and that plane should extend
out from beneath the IC, and be connected to ground plane on the board’s other side with several vias, to help
dissipate the heat. The exposed pad is internally connected to the IC substrate. Additionally the use of wide PC
board traces, where possible, can help conduct heat away from the IC. Judicious positioning of the PC board
within the end product, along with the use of any available air flow (forced or natural convection) can help reduce
the junction temperatures.
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