Datasheet

LM3490
SNVS012E –JUNE 1999–REVISED APRIL 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)(2)
Input Voltage (IN to GND) 35V
Voltage ON/OFF to GND 5.5V
Power Dissipation
(3)
400 mW
Junction Temp. (T
J
)
(3)
+150°C
Ambient Storage Temp. −65 to +150°C
Wave 4sec., 260°C
Soldering Time, Temp.
(4)
Infrared 10sec., 240°C
Vapor Phase 75sec., 219°C
ON/OFF 1.0kV
ESD
(5)
All Other Pins 2.0kV
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (T
J
- T
A
)/θ
JA
where T
J
is the junction temperature, T
A
is the ambient temperature, and θ
JA
is the junction-to-ambient thermal resistance. The 400 mW rating
results from substituting the Absolute Maximum junction temperature, 150°C, for T
J
, 50°C for T
A
, and 250°C/W for θ
JA
. More power can
be safely dissipated at lower ambient temperatures. Less power can be safely dissipated at higher ambient temperatures. The Absolute
Maximum power dissipation can be increased by 4 mW for each °C below 50°C ambient. It must be derated by 4 mW for each °C above
50°C ambient. A θ
JA
of 250°C/W represents the worst-case condition of no heat sinking of the 5-lead plastic SOT-23 package. Heat
sinking enables the safe dissipation of more power. The LM3490 actively limits its junction temperature to about 150°C.
(4) Times shown are dwell times. Temperatures shown are dwell temperatures. For detailed information on soldering plastic small-outline
packages, see http://www.ti.com.
(5) For testing purposes, ESD was applied using the human-body model, a 100 pF capacitor discharged through a 1.5 kΩ resistor.
OPERATING RATINGS
(1)
Maximum Input Voltage (IN to GND) 30V
Voltage ON/OFF to GND 0 to 5V
Junction Temperature (T
J
) −40 to +125°C
Maximum Power Dissipation
(2)
300 mW
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply ensured performance limits. For ensured performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) As with the Absolute Maximum power dissipation, the maximum power dissipation for operation depends on the ambient temperature.
The 300 mW rating appearing under Operating Ratings results from substituting the maximum junction temperature for operation,
125°C, for T
J
, 50°C for T
A
, and 250°C/W for θ
JA
in P = (T
J
− T
A
)/θ
JA
. More power can be dissipated at lower ambient temperatures. Less
power can be dissipated at higher ambient temperatures. The maximum power dissipation for operation appearing under Operating
Ratings can be increased by 4 mW for each °C below 50°C ambient. It must be derated by 4 mW for each °C above 50°C ambient. A
θ
JA
of 250°C/W represents the worst-case condition of no heat sinking of the 5-lead plastic SOT-23 package. Heat sinking enables the
dissipation of more power during operation.
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