Datasheet

LM3464, LM3464A
www.ti.com SNVS652F –APRIL 2010–REVISED MAY 2013
PIN DESCRIPTIONS (continued)
Pin Name Description Application Information
19 DR1 Channel 1 drain sense input This pin senses the drain voltage of the external MOSFET of channel 1 to
facilitate DHC operation and fault detection.
20 SE4 Channel 4 sense input Connect to an external sense resistor to define the Channel 4 LED current.
21 GD4 Channel 4 gate driver output Connect to the gate of external NMOS to control the channel 4 LED current.
22 PGND Power Ground Ground for power circuitry. Reference point for all stated voltages. Must be
externally connected to EP and AGND
23 GD3 Channel 3 gate driver output Connect to the gate of external NMOS to control the channel 3 LED current.
24 SE3 Channel 3 sense input Connect to an external sense resistor to define the Channel 3 LED current.
25 GD2 Channel 2 gate driver output Connect to the gate of external NMOS to control the channel 2 LED current.
26 SE2 Channel 2 sense input Connect to an external sense resistor to define the Channel 2 LED current.
27 GD1 Channel 1 gate driver output Connect to the gate of external NMOS to control the channel 1 LED current.
28 SE1 Channel 1 sense input Connect to an external sense resistor to define the Channel 1 LED current.
EP EP Thermal Pad (Power Ground) Used to dissipate heat from the package during operation. Must be electrically
connected to PGND external to the package.
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