Datasheet
Table Of Contents
- FEATURES
- APPLICATIONS
- DESCRIPTION
- ABSOLUTE MAXIMUM RATINGS
- RECOMMENDED OPERATING CONDITIONS
- ELECTRICAL CHARACTERISTICS
- TYPICAL PERFORMANCE CHARACTERISTICS
- OPERATION
- CURRENT REGULATOR OPERATION
- PROTECTION
- DESIGN PROCEDURE
- SETTING LED CURRENT CONTROL
- FIXED LED CURRENT
- ADJUSTABLE LED CURRENT
- INPUT CAPACITOR SELECTION
- RECOMMENDED OPERATING FREQUENCY AND ON TIME "TIMEON" CALCULATION
- TIMING COMPONENTS (RON and CON)
- INDUCTOR SELECTION
- POWER FET SELECTION
- DIM FET SELECTION
- BOOTSTRAP CAPACITORS
- SOFT-START CAPACITOR
- ENABLE OPERATION
- PWM DIM OPERATION
- LAYOUT CONSIDERATIONS
- APPLICATION INFORMATION
- Revision History

LM3434
SNVS619B –MARCH 2010–REVISED MAY 2013
www.ti.com
PWM DIM OPERATION
The DIM pin of the LM3434 is designed so that it may be controlled using a 1.6V or higher logic signal. The
PWM frequency easily accomodates more than 40kHz dimming and can be much faster if needed. If the PWM
DIM pin is not used, tie it to CGND or leave it open. The DIM pin is tied to CGND internally through a 100k pull
down resistor.
LAYOUT CONSIDERATIONS
The LM3434 is a high performance current driver so attention to layout details is critical to obtain maximum
performance. The most important PCB board design consideration is minimizing the loop comprised by the main
FET, synchronous FET, and their associated decoupling capacitor(s). Place the V
CC
bypass capacitor as near as
possible to the LM3434. Place the PWM dimming/shunt FET as close to the LED as possible. A ground plane
should be used for power distribution to the power FETs. Use a star ground between the LM3434 circuitry, the
synchronous FET, and the decoupling capacitor(s). The EP contact on the underside of the package must be
connected to V
EE
. The two lines connecting the sense resistor to CSN and CSP must be routed as a differential
pair directly from the resistor. A Kelvin connection is recommended. It is good practice to route the DIMO/DIMR,
HS/HO, and LO/LS lines as differential pairs. The most important PCB board design consideration is minimizing
the loop comprised by the main FET, synchronous FET, and their associated decoupling capacitor(s). Optimally
this loop should be orthogonal to the ground plane.
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